RX 7900XTX 24GB Sapphire Nitro+ GDDR6 3Fan

Software BIOS switch
You can switch from OC BIOS mode to Secondary mode or back with our TriXX software to quickly and easily switch between your dual BIOS modes.

Back plate
The backplate provides stability and improves heat dissipation so that the card always stays nice and cool.

ARGB
Customize the look of your NITRO+ card with the integrated ARGB.

Output
Connections: Choose between HDMI and DisplayPort with a maximum of 4 outputs

cooling
Innovative cooling technologies for maximum performance and optimal airflow

Vapor-X cooling
The Vapor Chamber is mounted in contact with the surface of the main chip and memory. Since the entire area transfers heat at the same rate, the Vapor-X module is designed to be more efficient at removing heat than a copper heatsink. When heat is generated, the heat source is pushed to the evaporation wicks to start the heat dissipation process. Due to the extremely low pressure, working fluid and pure water are easily vaporized and passed through the vacuum up to the condensation wick, which is located next to the cooled surface. From here it returns to the liquid state, with the liquid then absorbed into the transport wick by capillary action and moved back to the evaporation wick. A recirculated liquid system is created when the heat source reheats the liquid and it is re-evaporated by the evaporation wick to start the Vapor-X cooling process again.

Wave-shaped fin design & V-shaped fin design for GPU cooling
The wave-shaped fin design reduces frictional resistance as airflow enters the fin module, thereby reducing wind cutting noise.

The V-shaped fin design on top of the GPU accelerates and centralizes airflow around the GPU to efficiently dissipate heat.

Die-cast aluminum-magnesium alloy frame & front plate heatsink
The die-cast aluminum-magnesium alloy frame that wraps around the sides of the PCB contributes to the structural rigidity of the chassis and provides a strong, scratch-resistant, high-quality finish that enhances the aesthetics and strength of the graphics card. The die-cast front plate heatsink that covers the entire PCB cools the VRMs, memory, and chokes, providing excellent heat dissipation to ensure premium airflow and cooling performance.

Digital power supply
The SAPPHIRE NITRO+ & PULSE AMD Radeon™ RX 7900 are equipped with a digital power supply that enables precise energy control and consumption efficiency.

Ultra-high performance conductive polymer aluminum capacitor
The ultra-high performance and conductive polymer aluminum capacitor has a small PCB area but a high volumetric capacitance, which enables a 20-phase power supply on the RX 7900 series graphics card. The capacitor provides stable capacitance at high frequencies and temperatures with very low signal noise, ensuring the stability and reliability of the product.

High Tg copper circuit board
The GPU is mounted on a high-density 14-layer 2oz copper PCB with high glass transition temperature value to meet the high speed, high current and increased power requirements of the GPU and memory and to ensure high stability of the PCB during operation.

Metal backplate
The all-aluminum backplate provides additional rigidity, ensuring nothing bends and keeping dust out. It also helps cool your card by increasing heat dissipation.

Dedicated cooling of the voltage regulators
A dedicated cooling module for the voltage regulators ensures optimal heat dissipation, best airflow and best cooling performance.

Angular Velocity Fan Blade
The Angular Velocity fan blades provide a double layer of downward air pressure, which combined with the air pressure on the outer ring of the axial fan produces up to 44% more downward air pressure and up to 19% more airflow for quieter and cooler operation compared to previous generations.

Optimized composite heat pipe
The composite heat pipes are finely tuned for each individual cooling design with optimal heat flow and distribute the heat efficiently and evenly throughout the entire cooling module.

Assistive System Fan Control
As the GPU temperature increases, the graphics card fans will speed up accordingly. To further aid cooling and heat dissipation, the Assistive System Fan Control feature in SAPPHIRE“s TriXX software controls the speed of a system fan to automatically increase at the same time as the graphics card fans, helping to expel heated air from the entire system more quickly.

OC BIOS
This BIOS is designed for maximum TGP setting to maximize gaming performance.

Fuse protection
To protect your card, SAPPHIRE series cards feature a fuse built into the external PCI-E power connector circuitry to protect components from damage.

Dual BIOS
Choose between OC BIOS mode or Secondary mode to enhance your gaming experience.

Graphics card holder
The package includes a graphics card holder that holds the graphics card in place on the PCIe slot.

Dual ARGB Light Bar
With the tasteful case design, complemented by ARGB LEDs, you can change the colors of the LED for a customized design. This can be controlled via the TriXX software. Choose from different modes such as Fan Speed Mode, PCB Temperature Mode or the colorful rainbow mode or turn the LEDs off.

External synchronization of ARGB control
Enable external synchronization of the RGB LEDs between the graphics card and the motherboard via the 3-pin header at the end of the card. Gamers can then choose whether the graphics card runs the RGB LED effects independently or if the motherboard takes control.

Quick Connect Fan
If there is a fan issue, you don“t have to return the entire card. SAPPHIRE or our resellers will send you a replacement fan directly! This means they are easy to remove, clean and replace, and are held reliably in place with just one screw.

Double ball bearing
These have double ball bearing fans, which in our tests have a service life that is around 85% longer than plain bearings. Thanks to the improvements to the fan blades, the solution is up to 10% quieter than the previous generation.

Tri-X cooling technology
An innovative blend of robust VRM cooling and independent storage thermal modules work in parallel to dissipate heat efficiently and effectively across all areas.

Tunnel-shaped fins increase convection airflow and ensure that wind flows continuously through the cooling and fan system.

Heat is dissipated by a trio of large, efficient fans that run counterclockwise to maximize airflow.